Distributor
of
HTSP
Silicone Heat Transfer Compound Plus
Key Properties:
- Thermal Conductivity :0.9 W/m.k
- Excellent non-creep charactistics
- Vibration stable, designed for gap filling applications
- Wide operating temperature range: -50°C to +200°C
- Thermal conductivity even at high temperatures: 0.90 W/m.K
- Low in toxicity and economical in use
- Low evaporation weight loss
During use, some electronic components can generate significant amounts of heat. Failure to effectively dissipate this heat away from the component and the device can lead to reliability concerns and reduced operational lifetimes.
Examples: Processor in PC/Desktop, IGBT and Diode Modules in UPS, Drives & Power Supply, Inverter based Airconditioners
TCOR
Thermally Conductive Oxime RTV
Key Properties:
- Superior thermal conductivity even at high temperatures 3.0 W/m.K
- Excellent non-creep characteristics
- Wide operating temperature range -50°C to +200°C
- Low evaporation weight loss
We "ACME Electro Solutions" are distributor of Electro Chemicals and Electronic Component Solutions
HTC
Non-Silicone Heat Transfer Compound
Key Properties:
- Excellent non-creep characteristics
- Very high thermal conductivity; 0.9 W/m.K
- Wide operating temperature -50°C to +130°C
- Low evaporation weight loss
- Easy to use and available in aerosol form, HTCA
- Low toxicity
Key Properties:
- Single part, low odour RTV
- Very high thermal conductivity: 1.80 W/m.
- Exceptionally wide operating temperature range: -50°C to +230°C
- Moisture cure - releasing oxime upon cure
- Easy to apply - use with TCR Gun Applicator
- Good bond strength and remains flexible at high temperatures
Thermal Management